3M™ CMP Pad Conditioner Brush PB32A-1, 4.25-in dia

  • Part Number PB32A
  • 3M ID 7000000274
  • UPC 00051111900925
Carrier Diameter (Metric) 107.95 mm
Carrier Diameter (Imperial) 4.25 in

Excellent for soft CMP pads, including microreplicated, porometric and felt-based pads

Efficient pad cleaning and slurry distribution helps manufacturers enable low cost of ownership

Metal-free, polymer bristles resist corrosion

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Details

Highlights
  • Excellent for soft CMP pads, including microreplicated, porometric and felt-based pads
  • Efficient pad cleaning and slurry distribution helps manufacturers enable low cost of ownership
  • Metal-free, polymer bristles resist corrosion
  • Durable bristles are independently fixed across the brush surface
  • 3M™ CMP brush connects easily to polishing tool end effector
  • Designed for semiconductor grade CMP processes

Engineered specifically for chemical mechanical polishing (CMP) pad cleaning applications, our 3M™ CMP Pad Conditioner Brush is excellent for efficient pad cleaning and slurry distribution which helps manufacturers reduce cost of ownership in semiconductor operations. These 3M CMP brushes are part of a full range of 3M CMP solutions.

  • green CMP pad conditioner brush close up

    Excellent for use with soft CMP pads

    Strong, durable bristles are independently anchored and evenly distributed across the 3M brush surface, making the 3M brush ideal for removing pad debris from soft microreplicated, porometric and felt-based CMP pads. Bristles are made from an exclusive polymer that resists corrosion much better than metal. The polycarbonate carrier features a universal mounting configuration, making for easy connection to a wide range of polishing tools and effectors.

Advanced Node (Memory & Logic), CMP, Pad Cleaning and Wafer Manufacturing icons
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      Up NextRedefining CMP Materials
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      Up Next3M™ CMP Pad Conditioner Brushes

    Typical properties

    Abrasive Material

    Nylon Fibers

    Abrasive Working Surface

    Full Face

    Application

    CMP, Wafer Manufacturing, Pad Cleaning, Advanced Node (Memory & Logic)

    Brands

    3M™

    CMP Process

    W (Buff), Cu (Barrier), Final Buff

    Carrier Diameter (Imperial)

    4.25 in

    Carrier Diameter (Metric)

    107.95 mm

    Carrier Form

    Disc

    Carrier Material

    Polycarbonate

    Product Series

    PB32A

    Product Type

    Brush

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