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Engineered specifically for chemical mechanical polishing (CMP) pad cleaning applications, our 3M™ CMP Pad Conditioner Brush is excellent for efficient pad cleaning and slurry distribution which helps manufacturers reduce cost of ownership in semiconductor operations. These 3M CMP brushes are part of a full range of 3M CMP solutions.
Strong, durable bristles are independently anchored and evenly distributed across the 3M brush surface, making the 3M brush ideal for removing pad debris from soft microreplicated, porometric and felt-based CMP pads. Bristles are made from an exclusive polymer that resists corrosion much better than metal. The polycarbonate carrier features a universal mounting configuration, making for easy connection to a wide range of polishing tools and effectors.
Abrasive Material | Nylon Fibers |
Abrasive Working Surface | Full Face |
Application | CMP, Wafer Manufacturing, Pad Cleaning, Advanced Node (Memory & Logic) |
Brands | 3M™ |
CMP Process | W (Buff), Cu (Barrier), Final Buff |
Carrier Diameter (Imperial) | 4.25 in |
Carrier Diameter (Metric) | 107.95 mm |
Carrier Form | Disc |
Carrier Material | Polycarbonate |
Product Series | PB32A |
Product Type | Brush |
Data Sheets
(PDF, 373KB)
Data Sheets
(PDF, 120KB)
Data Sheets
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Data Sheets
(PDF, 116KB)
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