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3M™ Double Coated Tape PBT539 is a semiconductor wafer manufacturing tape designed for bonding and debonding during the semiconductor wafer manufacturing process.
A chemical mechanical planarization (CMP) tape, 3M™ Double Coated Tape PBT539 features a thin polyester film carrier for dimensional stability and excellent handling with ease of die cutting and laminating. It comes with 3M™ Adhesive 360 on either side, an acrylic-based adhesive that bonds to most surfaces, including high-surface-energy and low-surface-energy materials.
Adhesive Type | Quick Bond Acrylic Adhesive 360 |
Application | Laminating, CMP, Attaching, Bonding |
Back Side Adhesive Thickness (Imperial) | 3.5 mil |
Back Side Adhesive Thickness (Metric) | 88.9 Micron |
Back Side Adhesive Type | Quick Bond Acrylic Adhesive 360 |
Backing (Carrier) Material | PET |
Backing (Carrier) Thickness (Imperial) | 2 mil |
Backing (Carrier) Thickness (Metric) | 50.8 Micron |
Face Side Adhesive Thickness (Imperial) | 3.5 mil |
Face Side Adhesive Thickness (Metric) | 88.9 Micron |
Face Side Adhesive Type | Quick Bond Acrylic Adhesive 360 |
Indoor/Outdoor | Indoor |
Industries | Electronics |
Maximum Operating Temperature (Celsius) | 70 ℃ |
Maximum Operating Temperature (Fahrenheit) | 158 ℉ |
Minimum Operating Temperature (Celsius) | 10 ℃ |
Minimum Operating Temperature (Fahrenheit) | 50 ℉ |
Primary Liner | PET |
Primary Liner Color | Transparent |
Primary Liner Thickness (Imperial) | 3 mil |
Primary Liner Thickness (Metric) | 76.2 Micron |
Product Color | Tan |
Product Form | Roll |
Product Usage | CMP Pads, Polishing Pads |
Shelf Life | 36 Month |
Total Tape Thickness without Liner (Imperial) | 9 mil |
Total Tape Thickness without Liner (Metric) | 0.229 mm |
Data Sheets
(PDF, 126KB)
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