3M™ Boron Nitride Cooling Filler Agglomerates

3M ID B5005473000

Randomly orientated agglomerated single platelets for high through-plane thermal conductivity

Delivers excellent heat dissipation for protection of sensitive components

Isotropic heat transfer compared to platelets

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Tech Data Sheet (PDF, 100KB)

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Highlights

Randomly orientated agglomerated single platelets for high through-plane thermal conductivity
Delivers excellent heat dissipation for protection of sensitive components
Isotropic heat transfer compared to platelets
Soft bulk agglomerates adapt to matrix, helping maintain flexibility
Excellent for conformable thermal interface materials (TIMs)
High electrical insulation properties with low Dk and Df

3M™ Boron Nitride Cooling Filler agglomerates are randomly oriented agglomerates of crystalline boron nitride single platelets. Featuring excellent heat transfer capabilities, these agglomerates can help achieve much higher W/m*K vs. mineral or oxide fillers. Soft agglomerates adapt to the flexibility of the polymer matrix. 3M™ BN cooling filler agglomerates are especially good for thin thermal interface materials (TIMs) requiring consistent heat transfer and high through-plane conductivity.

Compound Viscosity Control
Conformability
Excellent Heat Dissipation
High Through-plane Conductivity

Excellent for through-plane conductivity

3M™ BN cooling filler agglomerates are a great choice for applications requiring high through-plane heat dissipation and consistent heat transfer. Randomly-oriented agglomerated platelets create isotropic thermal conductivity that performs even for very thin materials. Agglomerates are excellent for Thermal Interface Materials (TIMs) and other applications requiring dissipation of heat away from valuable components such as chips, LEDs, CPUs and EV battery cells.

A complete selection of 3M™ Boron Nitride Cooling Fillers includes platelets, flakes and agglomerates can meet a full range of performance specifications for in-plane and through-plane thermal conductivity.

Grades of 3M™ Boron Nitride Cooling Filler agglomerates:

CFA 50M

A mix (M) of agglomerates, platelets and boron nitride clusters is excellent for potting resins and encapsulation of electronic devices.
CFA 250S

Boron nitride platelets are spray-dried with an inorganic binder to spherical (S) granulates for high flowability and dosing velocities during feeding. They are ideal for thermal interface management (TIM) pads.
CFA 150

Soft agglomerates allow for high filler loadings and isotropic thermal conductivity. CFA 150 is used for potting resins and conformable TIM foils or pads with thin bond lines above 200 µm.
CFA 100

Soft agglomerates deliver the same uses and benefits as CFA 150, but can be used for materials with thinner bond lines from 150-200 μm.
CFA 75

Soft agglomerates deliver the same uses and benefits as CFA 100, but can be used for materials with bond lines as thin as 100-150 μm.

Table showing bulk density determined according to ASTM B329/ISO 3923-2 (Scott density) and according to ISO 23145-2 (DIN density).

Bulk density determined according to ASTM B329/ISO 3923-2 (Scott density) and according to ISO 23145-2 (DIN density)
Particle size distribution measured by laser light scattering (Mastersizer 2000, dispersion in ethanol)
For calculation purpose: Density of bulk hBN 2.25 g/cm³

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