3M™ Trizact™ Pad Conditioner T Series B25T-2910 TDS
3M™ Trizact™ Pad Conditioner T Series B6T-1900 Technical Data SheetContact a Sales Rep
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3M™ Trizact™ Pad Conditioner T Series
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Details
Highlights
- Enabled by proprietary 3M microreplication technology
- Extended lifetime and more stable removal rate compared to legacy designs
- Higher pad wear rate to enable a more durable, lower-lifetime-cost solution
- Larger grain size for CVD diamond to enable stronger pad activation
- Improved with new microcrystalline CVD diamond coating technology
- Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
- Metal-free cutting surface for advanced node processes sensitive to metal contamination
- Combine with 3M™ CMP Pad Conditioner Coatings for additional protection from metal contamination
3M™ Trizact™ Pad Conditioner T Series delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP) processes. The advanced 3M CVD diamond coating technology on 3M™ Trizact™ Pad Conditioner T Series offers highly consistent, strong, tunable pad activation for demanding CMP specifications and processes, including advanced nodes. Each pad conditioner provides microreplication technology to precisely shape the surface topography for excellent performance, without the risk of micro and macro scratching defects posed by conventional diamond grit abrasives. Enjoy a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance.
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Consistent Lifetime Performance -
Metal-Free Surface -
Slower Pad Wear Rate Decay -
Yield Improvement
Slower pad wear rate decay
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Conventional CMP pad conditionerAs pad conditioners wear down, the coefficient of friction decreases rapidly, leading to pad wear rate decay.
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3M™ Trizact™ Pad Conditioner T Series3M™ Trizact™ Pad Conditioner T Series maintains the tunable surface topography of 3M™ Trizact™ Pad Conditioners and combines it with increased diamond grain size to strengthen pad activation and reduce pad wear rate decay. This rougher diamond coating has a higher coefficient of friction that helps reduce pad wear rate decay by up to 4X.
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3M™ Trizact™ Pad Conditioner T Series Introduction
Redefining CMP Materials
Typical properties
| Abrasive Material | CVD coated ceramic |
| Abrasive Working Surface | T102-5 Pattern, B5-M990 Pattern, B6-1900 Pattern, B25-2910 Pattern |
| Application | CMP, Wafer Manufacturing, Advanced Node (Memory & Logic) |
| CMP Process | All, STI Process, W (Bulk) |
| Carrier Diameter (Imperial) | 4 in, 4.25 in |
| Carrier Diameter (Metric) | 101.6 mm, 107.95 mm |
| Carrier Form | Disc |
| Carrier Material | 304 Stainless Steel, Stainless Steel |
| Factory ISO Certification | No ISO Certification information available |
| Product Series | B6-1900, B6T-1900, B25T-2910, T |
| Product Type | Diamond Pad Conditioner |
Resources
Data Sheets
(PDF, 233KB)
Data Sheets
(PDF, 189KB)
Frequently asked questions
Yes, 3M™ Trizact™ Pad Conditioner T Series uses a thin diamond layer over a microreplicated ceramic substrate. The cutting surface is metal-free and ideal for sensitive advanced node processes.
Selecting a pad conditioner requires compatibility testing to confirm that your pad, wafer and slurry combination will perform optimally. Our technical team has data packages for many common chemistries – tungsten to copper, poly to STI, and many more – that have been proven compatible with our products. We can also test custom combinations at our labs around the world.
3M™ Trizact™ Pad Conditioner T Series builds on the proven technology of 3M™ Trizact™ Pad Conditioners. These pad conditioners have a rougher surface topography optimized for stronger pad activation and a reduced pad wear rate.
Submit the Contact a Sales Rep form on this page or any other 3M CMP materials webpage, and our team will get in touch with you to discuss your needs.
Similar products
| Carrier Diameter (Metric) | 101.6 mm, 107.95 mm | |||
| CMP Process | All, STI Process, W (Bulk) | |||
| Carrier Diameter (Imperial) | 4 in, 4.25 in |
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