3M™ Trizact™ Pad Conditioner T Series

3M™ Trizact™ Pad Conditioner T Series delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP) processes. The advanced 3M CVD diamond coating technology on 3M™ Trizact™ Pad Conditioner T Series offers highly consistent, strong, tunable pad activation for demanding CMP specifications and processes, including advanced nodes. Each pad conditioner provides microreplication technology to precisely shape the surface topography for excellent performance, without the risk of micro and macro scratching defects posed by conventional diamond grit abrasives. Enjoy a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance.

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  Consistent Lifetime Performance
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  Metal-Free Surface
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  Slower Pad Wear Rate Decay
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  Yield Improvement

Slower pad wear rate decay

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  Conventional CMP pad conditioner

  As pad conditioners wear down, the coefficient of friction decreases rapidly, leading to pad wear rate decay.

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  3M™ Trizact™ Pad Conditioner T Series

  3M™ Trizact™ Pad Conditioner T Series maintains the tunable surface topography of 3M™ Trizact™ Pad Conditioners and combines it with increased diamond grain size to strengthen pad activation and reduce pad wear rate decay. This rougher diamond coating has a higher coefficient of friction that helps reduce pad wear rate decay by up to 4X.