3M™ Diamond Pad Conditioner C Series C-250 Technical Data SheetContact a Sales Rep
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3M™ Diamond Pad Conditioner C Series
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Details
Highlights
- Optimized diamond shape, pitch control and diamond orientation
- Improved consistency and reduced disk-to-disk variation
- Slower pad wear rate decay with stable removal rate and profile
- Enables potential for longer disk life and pad life
- Uses 3M sintered abrasive technology for firm diamond adhesion
- 40% improvement in flatness control over legacy designs
- Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
- A good choice for metal-sensitive processes when combined with 3M™ CMP Pad Conditioner Coatings
3M™ Diamond Pad Conditioner C Series is a highly engineered chemical mechanical planarization (CMP) pad conditioner that helps you deliver reliable performance in your critical semiconductor CMP applications. It helps minimize wear and maintains consistent asperities and consistent pad performance — for wafer after wafer. These diamond disk conditioners use 3M proprietary sintered abrasive technology for excellent diamond retention, helping enable longer life and better shape and diamond orientation control than legacy diamond pad conditioners. The improved consistency and smaller variation enable you to reduce variables and optimize your CMP performance.
For metal-sensitive processes, 3M CMP Pad Conditioner Coatings can be factory-applied to 3M Diamond Pad Conditioners. These micron-thin coatings require minimal process changes and can reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance.
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Improved Consistency -
Optimized Topography -
Tunable Performance
Broad range of conditioning performance options
Extra-precise diamond placement
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Legacy 3M pad conditioner -
3M Diamond Pad Conditioner C Series
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3M™ Diamond Pad Conditioner C Series Introduction
Redefining CMP Materials
Typical properties
| Abrasive Material | Diamond |
| Abrasive Working Surface | Full Face |
| Application | CMP, Wafer Manufacturing, Advanced Node (Memory & Logic) |
| CMP Process | All, Cu (Bulk), Cu (Barrier) |
| Carrier Diameter (Imperial) | 4 in, 4.25 in |
| Carrier Diameter (Metric) | 101.6 mm, 107.95 mm |
| Carrier Form | Disc |
| Carrier Material | Stainless Steel |
| Diamond Size | 250 micron |
| Product Series | C |
| Product Type | Diamond Pad Conditioner |
Resources
Data Sheets
(PDF, 176KB)
Frequently asked questions
3M uses a proprietary sintered abrasive process that attaches diamonds to the substrate with both chemical and mechanical bonds to enhance diamond retention.
Selecting a pad conditioner requires compatibility testing to confirm that your pad, wafer and slurry combination will perform optimally. Our technical team has data packages for many common chemistries – tungsten to copper, poly to STI, and many more – that have been proven compatible with our products. We can also test custom combinations at our labs around the world.
3M™ Diamond Pad Conditioner C Series elevates our more than 25 years of experience with diamond pad conditioners to a new level of precision. Diamonds are placed in a precise grid at the micrometer scale, and oriented to maximize flatness, co-planarity and conditioning performance.
Submit the Contact a Sales Rep form on this page or any other 3M CMP materials webpage, and our team will get in touch with you to discuss your needs.
Similar products
| Carrier Diameter (Metric) | 101.6 mm, 107.95 mm | |||
| CMP Process | All, Cu (Bulk), Cu (Barrier) | |||
| Carrier Diameter (Imperial) | 4 in, 4.25 in | |||
| Diamond Size | 250 micron |
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