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3M™ Diamond Pad Conditioner C Series is a highly engineered chemical mechanical planarization (CMP) pad conditioner that helps you deliver reliable performance in your critical semiconductor CMP applications. It helps minimize wear and maintains consistent asperities and consistent pad performance — for wafer after wafer. These diamond disk conditioners use 3M proprietary sintered abrasive technology for excellent diamond retention, helping enable longer life and better shape and diamond orientation control than legacy diamond pad conditioners. The improved consistency and smaller variation enable you to reduce variables and optimize your CMP performance.
For metal-sensitive processes, 3M CMP Pad Conditioner Coatings can be factory-applied to 3M Diamond Pad Conditioners. These micron-thin coatings require minimal process changes and can reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance.
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