Contact a Sales Rep
Our apologies...
An error has occurred while submitting. Please try again later...
Thank you!
Your form was submitted successfully
3M™ Trizact™ Composite Slurry DE-100
- 3M Product Number DE-100
- 3M ID B5005276003
Details
Highlights
- Effective lapping and polishing for ultra-hard substrates such as silicon carbide and ceramics
- Reduced total thickness variation (TTV), higher removal rate and better surface finish compared to the copper platen process when used with 3M™ Trizact™ Polishing Pads
- High removal rate with good surface finish, a good option for fine lapping/pre-CMP step
- Easy cleanup with water
- Compatible with 3M™ Trizact™ Polishing Pads
- Compatible with both single- and dual-sided lapping tools
3M™ Trizact™ Composite Slurry DE-100 is a low-viscosity lapping slurry used for finishing ultra-hard substrates such as silicon carbide. This slurry provides the highest performance when used with 3M™ Trizact™ Polishing Pads.
Comprised of a unique nano-sized diamond composite in an agglomerate, Trizact composite slurry DE-100 produces an excellent surface finish with good removal rate, effective for fine lapping and the process step immediately before chemical mechanical planarization (CMP). It is water miscible for easy cleanup.
Typical properties
Resources
Similar products
| Application | Finishing, Lapping, Polishing, Pre-CMP, Scratch Removal | ||
| Product Usage | Semiconductor Wafers, Ultra-hard Substrates | ||
| Substrate | Gallium Arsenide, Gallium Nitride, Lithium Tantalate, Sapphire, Silicon Aluminum, Silicon Carbide, Silicon Nitride |
3M™ Trizact™ Composite Slurry DE-100
3M™ Trizact™ Composite Slurry DT-50
3M™ Trizact™ Composite Slurry DT-100Related Products
