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3M™ Trizact™ Polishing Pad HT-800-PC
- 3M Product Number HT-800-PC
- 3M ID B5005067114
Details
Highlights
- Effective lapping and polishing for ultra-hard substrates such as silicon carbide and ceramics
- Improved total pad life time and reduced total thickness variation (TTV), high removal rate and better surface finish compared to the copper platen process when used with 3M™ Trizact™ Composite Slurry, a good option for the rough lapping step
- Alternative to copper platen process with no need to re-groove copper platen and no copper in polishing waste
- 800 micron cell height for longer pad life
- High removal rates, a good option for rough lapping step
- Good surface finish
- Low TTV
- Can be directly mounted onto flat/smooth and waffle pattern lapping plates
- Easy pad replacement
3M™ Trizact™ Polishing Pad HT-800-PC is a microreplicated composite slurry lapping pad used for finishing ultra-hard substrates such as silicon carbide and sapphire.
Comprised of a microreplicated surface with a pressure-sensitive adhesive and polycarbonate core, Trizact polishing pad HT-800-PC produces a good surface finish with high removal rates for an economical finishing solution when combined with 3M™ Trizact™ Composite Slurry. This pad can be adhered to typical single- or double-sided lapping platens and is a good option for the rough lapping step.
Typical properties
Resources
Similar products
| Application | Finishing, Lapping, Polishing, Scratch Removal | ||
| Product Usage | Semiconductor Wafers, Ultra-hard Substrates | ||
| Substrate | Gallium Arsenide, Gallium Nitride, Lithium Tantalate, Sapphire, Silicon Aluminum, Silicon Carbide, Silicon Nitride |
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