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3M™ Trizact™ Pad Conditioner
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Details
Highlights
- 3D microreplicated structures help manufacturers deliver precision and control for unique requirements
- Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
- Metal-free cutting surface for advanced node processes sensitive to metal contamination
- Outstanding disk-to-disk consistency for predictive performance
- Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
- Combine with 3M™ CMP Pad Conditioner Coatings for additional protection from metal contamination
3M™ Trizact™ Pad Conditioner delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). The diamond-coated ceramic construction on 3M™ Trizact™ Pad Conditioner is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives. It has a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance.
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Microreplication – when consistency and precision really matter
Featuring precisely shaped, three-dimensional abrasive structures, 3M™ Trizact™ Pad Conditioner is ideal for work where consistency is essential. Ceramic structures are coated with micron-graded diamond. Through microreplication — a core 3M technology applied to advanced node semiconductor manufacturing — these structures are reproduced uniformly across the 3M™ Trizact™ Pad Conditioner surface. What’s more, you can choose from a wide range of tip shapes, height dispersions and patterns to suit your unique applications. The result: long-lasting, extremely consistent performance, longer CMP pad life, and predictable pad finish and pad wear, time after time.
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Typical properties
| Abrasive Material | CVD coated ceramic |
| Abrasive Working Surface | B5-M990 Pattern, B6-1900 Pattern, B75-2990 Pattern |
| Application | Advanced Node (Memory & Logic), Wafer Manufacturing, CMP |
| Brands | Trizact™ |
| CMP Process | Cu (Barrier), STI Process |
| Carrier Diameter (Imperial) | 4.25 in |
| Carrier Diameter (Metric) | 107.95 mm |
| Carrier Form | Disc |
| Carrier Material | Stainless Steel |
| Product Series | B5-M990, B6-1900, B75-2990 |
| Product Type | Diamond Pad Conditioner |
Resources
Regulatory Data Sheet
Document Number: MSDS_3439692_US_EN_RDS
(PDF)
Similar products
| Carrier Diameter (Metric) | 107.95 mm | |||
| CMP Process | Cu (Barrier), STI Process | |||
| Carrier Diameter (Imperial) | 4.25 in |
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