3M™ Trizact™ Polishing Pad HT-250 TDSContact a Sales Rep
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3M™ Trizact™ Polishing Pad HT-250
- 3M Product Number HT-250
- 3M ID B5005036184
Details
Highlights
- Effective lapping and polishing for ultra-hard substrates such as silicon carbide and ceramics
- Reduced total thickness variation (TTV), improved removal rate and better surface finish compared to the copper platen process when used with 3M™ Trizact™ Composite Slurry, a good option for the rough lapping step
- Alternative to copper platen process with no need to re-groove copper platen and no copper in polishing waste
- Long pad life
- Good TTV
- High removal rates
- Good surface finish
- Good option for rough lapping step
- Easy pad replacement
- Can be directly mounted onto flat/smooth and waffle pattern lapping plates
3M™ Trizact™ Polishing Pad HT-250 is a microreplicated silicon wafer lapping pad for finishing ultra-hard substrates such as sapphire, silicon carbide and ceramics.
Used in the rough lapping process step, Trizact polishing pad HT-250 is used in combination with 3M™ Trizact™ Composite Slurries. It can be adhered to single- or double-sided lapping platens.
Typical properties
| Application | Finishing, Scratch Removal, Polishing, Lapping |
| Product Usage | Ultra-hard Substrates, Semiconductor Wafers |
| Substrate | Gallium Arsenide, Gallium Nitride, Lithium Tantalate, Sapphire, Silicon Aluminum, Silicon Carbide, Silicon Nitride |
Resources
Data Sheets
(PDF, 139KB)
Similar products
| Application | Finishing, Scratch Removal, Polishing, Lapping | ||
| Product Usage | Ultra-hard Substrates, Semiconductor Wafers | ||
| Substrate | Gallium Arsenide, Gallium Nitride, Lithium Tantalate, Sapphire, Silicon Aluminum, Silicon Carbide, Silicon Nitride |
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