3M™ Diamond Pad Conditioner

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Optimized for extended pad and disk life

Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership

Diamonds secured with both chemical and mechanical bonds for great retention

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3M™ Diamond Pad Conditioner covered with a 3M CMP Pad Conditioner Coating, with a water droplet on the surface.
Advanced protection from metal contamination

Add a 3M coating to help reduce metal contamination by up to 99%. A good choice for advanced and mature nodes, harsh slurries and more.

Details

Highlights
  • Optimized for extended pad and disk life
  • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance
  • Customizable for conditioning aggressiveness
  • Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
  • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
  • For metal-sensitive processes, combine with 3M™ CMP Pad Conditioner Coatings

3M™ Diamond Pad Conditioner is a highly engineered chemical mechanical planarization (CMP) pad conditioner that delivers reliable performance for critical semiconductor CMP applications. It helps minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.

For metal-sensitive processes, 3M™ CMP Pad Conditioner Coatings can be factory-applied to 3M™ Diamond Pad Conditioners. These micron-thin coatings are used in advanced and mature node processes sensitive to metal, or with the harsh slurries often incorporated into tungsten or silicon carbide processes. They require minimal process changes and can help reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance.

Set of icons representing the recommended applications of Advanced Node, CMP, Hard Disk Manufacturing and Wafer Manufacturing

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