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3M™ Diamond Pad Conditioner Bar
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Details
Highlights
- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for great retention
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.
Typical properties
| Abrasive Material | Nickel-based Alloy with Patterned Diamond |
| Abrasive Working Surface | Full Face |
| Application | CMP, Wafer Manufacturing |
| CMP Process | W (Bulk), Cu (Bulk) |
| Carrier Form | Bar |
| Carrier Length (Imperial) | 11.63 in |
| Carrier Length (Metric) | 295.402 mm |
| Carrier Material | 316 Stainless Steel |
| Diamond Size | 251 micron |
| Factory ISO Certification | No ISO Certification information available |
| Product Series | R400 |
| Product Type | Diamond Pad Conditioner |
Resources
Safety Data Sheets
Document Number: MSDS_0884890_US_EN
(PDF)
Similar products
| Diamond Size | 251 micron |
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