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3M™ Diamond Pad Conditioner Ring
- | Select product options for IDs.
Details
Highlights
- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disc life
- Diamonds secured with both chemical and mechanical bonds for great retention
- Controlled diamond placement and protrusion for consistent and reliable performance through disc life
3M™ Diamond Pad Conditioner Ring is a highly engineered pad conditioner designed to deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.
Typical properties
| Abrasive Material | Nickel-based Alloy with Patterned Diamond |
| Abrasive Working Surface | Segmented |
| Application | CMP, Wafer Manufacturing |
| CMP Process | PMD/ILD, W (Bulk), Cu (Bulk) |
| Carrier Diameter (Imperial) | 10.236 in, 14.173 in |
| Carrier Diameter (Metric) | 260 mm, 360 mm |
| Carrier Form | Ring |
| Carrier Material | 304 Stainless Steel |
| Diamond Size | 181 micron, 250 micron, 251 micron |
| Factory ISO Certification | No ISO Certification information available |
| Product Series | E187, E221, E3910, E3920 |
| Product Type | Diamond Pad Conditioner |
Resources
Safety Data Sheets
Document Number: MSDS_0884890_US_EN
(PDF)
Similar products
| Carrier Diameter (Metric) | 260 mm, 360 mm | |
| CMP Process | PMD/ILD, W (Bulk), Cu (Bulk) | |
| Carrier Diameter (Imperial) | 10.236 in, 14.173 in | |
| Diamond Size | 181 micron, 250 micron, 251 micron |
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