3M™ Diamond Lapping Film 662XW has a higher diamond concentration and a stronger resin bond to give this product added durability and increased cut rate over our standard diamond lapping film. Available in 0.50, 1.0, 1.50, 3.0, 6.0 and 9.0 micron grades.
Standard Lead Time: 12 Calendar Days
Abrasive Material | Diamond |
Application | Flat Lapping, Polishing, Superfinishing |
Attachment Type | Plain Back |
Backing Thickness (Imperial) | 3 mil |
Backing Thickness (Metric) | 0.076 mm |
Factory ISO Certification | No ISO Certification information available |
Micron Grade | 6 μm,0.5 μm,0.50 μm,3 μm,1 μm |
Polishing Process | Step 2b: Refine/Level Connector (Ceramic Connector) |
Product Form | Roll, Sheet |
Product Series | 662XW |
Product Usage | Ceramic Fiber Optic Connectors, Fiber Optic Connectors |
Substrate | Carbide, Ceramic, Composite, Exotic Alloy, Glass, Stone |
Overall Length (Imperial) | 6 in, 8.5 in, 11 in, 50 ft |
Overall Length (Metric) | 15.24 m, 152.4 mm, 215.9 mm, 279.4 mm |
Overall Width (Imperial) | 1 in, 6 in, 8.5 in, 9 in |
Overall Width (Metric) | 25.4 mm, 152.4 mm, 215.9 mm, 228.6 mm |
Regulatory Data Sheet
Document Number: MSDS_1169044_US_EN_RDS
(PDF , 0B)