3M™ Thermally Conductive Silicone Interface Pad 5300-SP

3M™ Thermally Conductive Silicone Interface Pad 5300-SP is a specially designed cushion sheet with high thermal conductivity and reliable restoration properties.

This material is specifically used for the assembly of electrical connection by ACF (anisotropic conductive film) on TFT-LCD (Thin Film Transistor - Liquid Crystal Display) module, touch screen module, camera module and other flexible circuit board bonding on electronic parts. These products can be used as the special functional sheet during the ACF bonding process to improve heat and pressure distribution of Thermode (heating tool) on application area and prevent any damage on electrical connection and bonding part during electrical connection/assembly process. Through its high thermal conductivity and superior softness originated from silicone layer, it promotes fast and uniform heat transfer and pressure distribution with no damage on PCB and flex circuit part.