3M™ Trizact™ Composite Slurry DT-50

3M Product Number DT-50
3M ID B40055134

Effective lapping and polishing for ultra-hard substrates such as silicon carbide and ceramics

Improved total thickness variation (TTV), removal rates and surface finish compared to the copper platen process when used with 3M™ Trizact™ Polishing Pads

High removal rate, good option for rough lapping step

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Frequently viewed resources

Tech Data Sheet (PDF, 123KB)

Details

Highlights

Effective lapping and polishing for ultra-hard substrates such as silicon carbide and ceramics
Improved total thickness variation (TTV), removal rates and surface finish compared to the copper platen process when used with 3M™ Trizact™ Polishing Pads
High removal rate, good option for rough lapping step
Good surface finish with high removal rate
Easy cleanup with water
Compatible with 3M™ Trizact™ Polishing Pads
Can be used with either single- or dual-sided lapping tools
Good option for rough lapping step

3M™ Trizact™ Composite Slurry DT-50 is a low-viscosity lapping slurry for finishing ultra-hard substrates such as sapphire and silicon carbide. Trizact composite slurry DT-50 provides the highest performance when used with 3M™ Trizact™ Polishing Pads.

Comprised of a unique 3 micron diamond composite in triethylene glycol, Trizact composite slurry DT-50 produces a good surface finish with high removal rates for economical lapping. The triethylene glycol in this product is water miscible for easy cleanup.

Typical properties

Details

Application	Polishing, Finishing, Scratch Removal, Lapping
Product Usage	Semiconductor Wafers, Ultra-hard Substrates
Substrate	Gallium Arsenide, Gallium Nitride, Lithium Tantalate, Sapphire, Silicon Aluminum, Silicon Carbide, Silicon Nitride

Resources

3M™ Trizact™ Composite Slurry DT-50 3 micron TDS

Data Sheets

(PDF, 123KB)

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