3M™ Trizact™ CMP Pad

Options available
| Select product options for IDs.

Current Time 0:00

Duration 0:00

Loaded: 0%

Stream Type LIVE

Remaining Time 0:00

Uniformity in the chemical mechanical planarization (CMP) process

Consistent texture from pad to pad

Stability through pad life

Overall Diameter (Imperial)

Overall Diameter (Metric)

Select product options

Details

Highlights

Uniformity in the chemical mechanical planarization (CMP) process
Consistent texture from pad to pad
Stability through pad life
Improved planarization efficiency to enable advanced node CMP
Reduced dishing and erosion
Less pad debris for fewer defects
Reduced metal contamination risk

3M™ Trizact™ CMP Pads use microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life. This proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner, enabling you to have lower cost of ownership and less downtime.

An innovative CMP material, 3M™ Trizact™ CMP Pads are for advanced node semiconductor manufacturing. Their precisely engineered three-dimensional microreplicated asperities and pores helps to ensure uniform asperity diameter, height and pore depth. The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of semiconductor fabrication. The innovative groove design on these CMP pads help provide efficient and uniform slurry flow distribution.