3M™ Thermally Conductive Silicone Interface Pad 5595S

  • 3M ID B10469519

Good thermal stability of the base polymer with excellent softness of the thermal pad.

Good thermal conductivity in a soft silicone polymer base.

The product tack is such that a mechanical means to support the pad in a final assembly is required.

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3M™ Thermally Conductive Silicone Interface Pads Selection Guide

Details

Highlights
  • Good thermal stability of the base polymer with excellent softness of the thermal pad
  • Good thermal conductivity in a soft silicone polymer base
  • The product tack is such that a mechanical means to support the pad in a final assembly is required
  • This "S" version has a permanent PEN film, 9 micrometer thick, on one side to provide for a non-tacky surface, increased puncture resistance, ease of handling and rework

3M™ Thermally Conductive Silicone Interface Pad 5595S is a very conformable and soft pad with thermal conductivity of 1.6 W/m-K (3M test method). This pad is the "S" version of 55195, featuring a supporting layer for easy handling and assembly. This pad consists of a slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component's life.

3M™ Thermally Conductive Silicone Interface Pad 5595S has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The "S" supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm low-tack layer provides easy handling for pre-assembly and die-cutting. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.


Recommended Applications:
Heat transfer between PCB and heat sink
Integrated chip (IC) packaging heat conduction
Chip on film (COF) heat dissipation
Gap filling in electronic devices
Decrease of compression stress to electronic parts by thermal pad softness


Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices


Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.
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