3M™ Thermal Bonding Film AF111

3M ID B10454895

Moderate tack

Thick 10 mil caliper

250 degree F (121 degree C) cure

Details

Highlights

Moderate tack
Thick 10 mil caliper
250 degree F (121 degree C) cure
High metal OLS and peel adhesion
High flow
40 degree F (4 degree C) storage required

3M™ Thermal Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).

This hot melt film adhesive may be cured at temperatures as low as 225 Degrees F. Provides excellent strength for either metal to melt or honeycomb sandwich applications. Releases no volatile by-products during cure thereby permitting low pressure bonding.

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