3M™ MetPak™ 2-FB Inverse Header, MP2 Series

Three levels of early mate, late break (EMLB) sequencing or selective loading options

Footprint compatible with standard Futurebus+®

Solder tail with true-position wafer

Three levels of early mate, late break (EMLB) sequencing or selective loading options
Footprint compatible with standard Futurebus+®
Solder tail with true-position wafer
Ideal for hot swapping applications
End-to-end stackable
Right angle male for daughter card
Mates with MP2-R for backplane applications and MP2-SXXXG for coplanar applications
See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
For more information, refer to Data Sheet TS1122 (TS-1122)

2 mm 5-Row, Right Angle, Solder Tail

Connector Style	Pin Header
Contact Base Material	Copper Alloy
Current Rating	1.5 A
Features	Board Guide, Inverse
Flammability	UL 94V-0
Insulation Color	Beige
Insulation Material	High Temperature LCP
Insulation Resistance	10^3 MegaOhms
Mating Contact Finish Material	Gold
Mating Contact Finish Thickness (Imperial)	3 µin, 30 µin
Mating Contact Finish Thickness (Metric)	0.076 µm, 0.76 µm
Moisture Sensitivity Level	1 (Per J-STD-020C)
Mounting Type	Boardmount
Number of Contact Rows	5
Number of Contacts	30 , 60 , 120 , 210 , 240
PCB Mounting Angle	Right Angle
PCB Mounting Style	Through Hole
Packaged Form	Bulk, Tube
Physical Plating Property	50 microinches [1.27 micrometers] Nickel, 50 micro inches [1.27 micro meter] Nickel
Pitch (Imperial)	0.079 in
Pitch (Metric)	2 mm
Process Temperature Rating	260 Degrees C (Profile per J-STD-020C)
Product Series	MP2
Solder Tails	See Ordering Information
Tech Sheet Number	TS-1122
Temperature Rating	-55 Degree C to +125 Degree C
Termination Method	Solder
UnderPlating Material	50 micro inches [1.27 micro meter] Nickel
Wiping Area (Plating)	See Ordering Information
Withstanding Voltage	1000 VAC

Data Sheets

(PDF, 233KB)

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