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3M™ Thermal Bonding Film 583
- | Select product options for IDs.
Details
Highlights
- Flexible
- Heat or solvent activation
- Can be die-cut
- Slight surface tack
- Heat crosslinkable option
- Lower temperature lamination of the nitrile phenolic film range
3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
This hot melt film adhesive provides a strong, permanent bond to the surface to which it is applied. The adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form.
Typical properties
| Curing Temperature (Celsius) | 107 ℃, 107 ℉ |
| Curing Temperature (Fahrenheit) | 225 ℉ |
| Maximum Operating Temperature (Celsius) | 150 ℃ |
| Maximum Operating Temperature (Fahrenheit) | 300 ℉ |
| Product Color | Brown |
| Product Form | Roll |
| Shear Strength | 14 psi |
| Overall Length (Imperial) | 3 yd, 60 yd, 180 yd, 360 yd |
| Overall Length (Metric) | 2.7 m, 54.9 m, 164.6 m, 329.184 m |
| Overall Thickness (Metric) | 5 mm |
| Overall Width (Imperial) | 0.5 in, 0.75 in, 1 in, 2 in, 3 in, 4 in, 6 in, 9 in, 10 in, 12 in, 18 in, 24 in, 48 in |
| Overall Width (Metric) | 12.7 mm, 19.05 mm, 25.4 mm, 50.8 mm, 76.2 mm, 101.6 mm, 152.4 mm, 228.6 mm, 254 mm, 304.8 mm, 457.2 mm, 609 mm, 1219.2 mm |
Resources
Safety Data Sheets
Document Number: MSDS_1048826_US_EN
(PDF)
Legal disclaimer
The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.
