Email Us
Our apologies...
An error has occurred while submitting. Please try again later...
Thank you!
Your form was submitted successfully
961 Series, .100" (2.54mm) Header, Single and Dual Row, Right Angle, Solder Tail
Application | Board-to-board Connecting, Wire-to-board Connecting |
Contact Base Material | Copper Alloy |
Contact Termination Area Plating Material | Matte Tin |
Contact Termination Area Plating Thickness (Imperial) | 40 µin - 118 µin |
Contact Termination Area Plating Thickness (Metric) | 1 µm - 3 µm |
Contact Underplating Material | Nickel |
Contact Underplating Thickness (Imperial) | 50 µin - 100 µin |
Contact Underplating Thickness (Metric) | 1.25 µm - 2.5 µm |
Insulation Color | Black |
Insulation Material | High Temperature Thermoplastic |
Insulation Resistance | >5x10⁸ Ω @ 100 VDC |
Maximum Operating Temperature (Celsius) | 105 ℃ |
Maximum Operating Temperature (Fahrenheit) | 221 ℉ |
Minimum Operating Temperature (Celsius) | -25 ℃ |
Minimum Operating Temperature (Fahrenheit) | -13 ℉ |
Moisture Sensitivity Level | 1 (Per J-STD-020C) |
Specifications Met | UL 94V-0 |
Tech Sheet Number | TS-2182 |
Data Sheets
(PDF, 112KB)
Data Sheets
(PDF, 845KB)
An error has occurred while submitting. Please try again later...
Your form was submitted successfully