3M™ Pin Strip Header, 961 Series

  • 3M ID B00046734

High temperature dielectric

“No lead” wave and reflow solder compatible

End stackable feature

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PDF (1) Copy 26Tech Data Sheet (PDF, 112KB)

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Details

Highlights
  • High temperature dielectric
  • “No lead” wave and reflow solder compatible
  • End stackable feature
  • Single- and dual row version
  • Mates with boardmount and wiremount products
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more information, refer to Data Sheet TS2182 (TS-2182)

961 Series, .100" (2.54mm) Header, Single and Dual Row, Right Angle, Solder Tail

Typical properties

Application

Board-to-board Connecting, Wire-to-board Connecting

Contact Base Material

Copper Alloy

Contact Termination Area Plating Material

Matte Tin

Contact Termination Area Plating Thickness (Imperial)

40 µin - 118 µin

Contact Termination Area Plating Thickness (Metric)

1 µm - 3 µm

Contact Underplating Material

Nickel

Contact Underplating Thickness (Imperial)

50 µin - 100 µin

Contact Underplating Thickness (Metric)

1.25 µm - 2.5 µm

Insulation Color

Black

Insulation Material

High Temperature Thermoplastic

Insulation Resistance

>5x10⁸ Ω @ 100 VDC

Maximum Operating Temperature (Celsius)

105 ℃

Maximum Operating Temperature (Fahrenheit)

221 ℉

Minimum Operating Temperature (Celsius)

-25 ℃

Minimum Operating Temperature (Fahrenheit)

-13 ℉

Moisture Sensitivity Level

1 (Per J-STD-020C)

Specifications Met

UL 94V-0

Tech Sheet Number

TS-2182

Resources

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