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Low Profile, Four-Row, Through-Hole
Contact Base Material | Copper Alloy |
Contact Underplating Material | Nickel |
Contact Underplating Thickness (Imperial) | 50.0 µin |
Contact Underplating Thickness (Metric) | 1.27 µm |
Current Rating | 1.0 A |
Frame Style | Closed |
Insulation Material | Glass Filled Polyester (PBT) |
Integrated Circuit Type | PLCC |
Mating Contact Finish Material | Matte Tin |
Mating Contact Finish Thickness (Imperial) | 160 µin |
Mating Contact Finish Thickness (Metric) | 4.06 µm |
Maximum Operating Temperature (Celsius) | 105 ℃ |
Maximum Operating Temperature (Fahrenheit) | 221 ℉ |
Minimum Operating Temperature (Celsius) | -40 ℃ |
Minimum Operating Temperature (Fahrenheit) | -40 ℉ |
Number of Contact Rows | 4 |
Number of Contacts | 20 , 28 , 32 , 44 , 52 , 68 , 84 |
PCB Mounting Style | Through Hole |
Pitch (Imperial) | 0.05 in |
Pitch (Metric) | 1.27 mm |
Tech Sheet Number | TS-2148 |
Data Sheets
(POSTSCRIPT , 932KB)
Data Sheets
(PDF , 139KB)
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