3M™ Chip Carrier Sockets, 8400 Series

  • 3M ID B00046548
  • UPC 00051111663059

Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular

Compatible with automated loading equipment

Open top design allows unrestricted air flow

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PDF (1) Copy 26Tech Data Sheet (POSTSCRIPT, 932KB)

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Details

Highlights
  • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular
  • Compatible with automated loading equipment
  • Open top design allows unrestricted air flow
  • Molded slots for ease of device extraction
  • Wave solder compatible. Not suitable for reflow soldering
  • RoHS Compliant. See Regulatory Information Appendix link for chemical compliance information
  • For more information, refer to Data Sheet TS2148 (TS-2148)

Low Profile, Four-Row, Through-Hole

Typical properties

Contact Base Material

Copper Alloy

Contact Underplating Material

Nickel

Contact Underplating Thickness (Imperial)

50.0 µin

Contact Underplating Thickness (Metric)

1.27 µm

Current Rating

1.0 A

Frame Style

Closed

Insulation Material

Glass Filled Polyester (PBT)

Integrated Circuit Type

PLCC

Mating Contact Finish Material

Matte Tin

Mating Contact Finish Thickness (Imperial)

160 µin

Mating Contact Finish Thickness (Metric)

4.06 µm

Maximum Operating Temperature (Celsius)

105 ℃

Maximum Operating Temperature (Fahrenheit)

221 ℉

Minimum Operating Temperature (Celsius)

-40 ℃

Minimum Operating Temperature (Fahrenheit)

-40 ℉

Number of Contact Rows

4

Number of Contacts

20 , 28 , 32 , 44 , 52 , 68 , 84

PCB Mounting Style

Through Hole

Pitch (Imperial)

0.05 in

Pitch (Metric)

1.27 mm

Tech Sheet Number

TS-2148

Resources

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