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Boardmount Receptacle, Through-hole, Right Angle, Shielded, Condo
Application | Connection Stability, EMI Shielding, High-density Mounting, Repetitive Mating & Unmating |
Connector Style | Receptacle |
Contact Base Material | Copper Alloy |
Contact Underplating Material | Nickel |
Contact Underplating Thickness (Imperial) | 100 μin |
Contact Underplating Thickness (Metric) | 2.54 μm |
Current Rating | 1.0 A |
Features | PCB Retention |
Insulation Material | Glass Filled Polyester (PBT) |
Markings | 3M Logo and Part Number |
Mating Contact Finish Material | Gold |
Mating Contact Finish Thickness (Imperial) | 20 μin |
Mating Contact Finish Thickness (Metric) | 0.5 μm |
Maximum Operating Temperature (Celsius) | 85 ℃ |
Maximum Operating Temperature (Fahrenheit) | 185 ℉ |
Minimum Operating Temperature (Celsius) | -55 ℃ |
Minimum Operating Temperature (Fahrenheit) | -67 ℉ |
Mounting Type | Boardmount |
Number of Contact Rows | 2 |
Number of Contacts | 20 , 40 , 100 , 132 , 200 |
PCB Mounting Angle | Right Angle |
PCB Mounting Style | Through Hole |
Pitch (Imperial) | 0.05 in |
Pitch (Metric) | 1.27 mm |
Product Usage | Electronic Devices, Boardmount |
Shell Material | Steel |
Shell Plating | Nickel |
Specifications Met | China RoHS |
Tech Sheet Number | TS-0671 |
Termination Method | Solder |
Data Sheets
(PDF, 794KB)
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