3M™ HDC Socket, HDC Series

Ideal for parallel 4-row PCB stacking

Press-Fit tail requires only flat push tool for installation

Mates with 4-row single-bay headers and plugs

.100" Vertical, PCB/Backplane, Solder Tail or Press-Fit

Connector Style	Receptacle
Contact Base Material	Copper Alloy
Current Rating	3.0 A
Factory ISO Certification	No ISO Certification information available
Features	Mating Guide
Flammability	UL 94V-0
Insulation Color	Black
Insulation Material	Glass Filled Thermoplastic (LCP)
Insulation Resistance	>1x10³ MΩ @ 500 VDC
Markings	Part Number and Date Code
Mating Contact Finish Material	Gold
Mating Contact Finish Thickness (Imperial)	3 µin, 30 µin
Mating Contact Finish Thickness (Metric)	0.076 µm, 0.76 µm
Moisture Sensitivity Level	1 (Per J-STD-020C)
Mounting Type	Boardmount
Number of Contact Rows	4
Number of Contacts	128 , 160 , 200
PCB Mounting Style	Through Hole
Packaged Form	Bulk
Physical Plating Property	50 microinches [1.27 micrometers] Min. Nickel
Pitch (Imperial)	0.1 in
Pitch (Metric)	2.54 mm
Process Rating	Maximum 260 Degree C (per J-STD-020C)
Product Series	HDC
Tech Sheet Number	TS-1138
Temperature Rating	-55 Degree C to +105 Degree C
Temperature Rating: USA	-55 Degrees C to +105 Degrees C
Termination Area	See Ordering Information
Termination Method	Solder, Press Fit
UnderPlating Material	50 micro inches [1.27 micro meter] Min. Nickel
Wiping Area (Plating)	See Ordering Information
Withstanding Voltage	900 VAC for 1 minute

Regulatory Data Sheet

Document Number: MSDS_3813250_US_EN_RDS

(PDF)

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