3M™ CP2 Press-Fit Header, CP2 Series

  • 3M Product Number CP2 Series
  • 3M ID B00036515
  • UPC 00051119933840

Helps achieve high signal density in cost-effective applications

Modular design (38, 44 and 50 mm modules, 2 mm grid spacing)

Type AB, 95, 125 signal contacts

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Highlights
  • Helps achieve high signal density in cost-effective applications
  • Modular design (38, 44 and 50 mm modules, 2 mm grid spacing)
  • Type AB, 95, 125 signal contacts
  • Press-fit pin design helps technicians verify accurate connections
  • Three contact mating levels are excellent for early mate/late break or "hot swap" applications
  • End-to-end stackable 
  • Mates with 5-row 3M™ MetPak™ HSHM, UHM and CP2 Sockets
  • Available with additional grounding rows for greater ground bounce and EMI control
  • Feed through termination available for midplane applications
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more Information refer to Data Sheet TS2263 (TS-2263)

The 3M™ CP2 Press-Fit Header, CP2 Series helps achieve high signal density in cost-effective applications. Modular headers use a basic unit of 25 mm, and can be designed in versatile 38, 44 or 50 modules with 2 mm grid spacing. Type AB, 95, 110 and 125 2 mm signal contacts feature a press-fit pin design that helps verify smooth and accurate connections. Three contact mating levels make these headers excellent for hot swapping and early mate/late break applications.

End-stackable header mates with 5 row 3M™ MetPak™ sockets. The 3M press-fit header, CP2 series is available with additional grounding rows for greater ground bounce and EMI control, as well as feed through termination for midplane applications.

Typical properties

Connector Style

Pin Header

Contact Base Material

Copper Alloy

Contact Resistance

<= 20 MilliOhms

Current Rating

1.0 A

Electrical Load

1.0 Ampere at +70 Degree C

Insulation Color

Beige

Insulation Flammability Rating

UL 94V-0

Insulation Material

Glass Filled Polyester (PBT)

Insulation Resistance

>= 10,000 MegaOhm

Mating Contact Finish Material

Gold

Mating Contact Finish Thickness (Imperial)

30 µin

Mating Contact Finish Thickness (Metric)

0.76 µm

Mating Force

0.75 N/contact maximum

Mounting Type

Boardmount

Number of Contact Rows

5 , 7

Number of Contacts

95 , 154

Orientation

Vertical

PCB Mounting Style

Through Hole

PCB Thickness

2.4-5.6 mm for 3.7 mm tails, 1.4-5.6 mm for 2.3 mm tails

Packaged Form

Bulk

Pitch (Imperial)

0.079 in

Pitch (Metric)

2 mm

Press-In Force

<= 204N/pin on nominal hole diameter

Product Series

CP2

Recommended PCB Plated Through Hole

Ø 0.6 ± 0.05 mm

Retention Force

>= 13.5 N/pin on nominal hole diameter

Separable

Yes

Tech Sheet Number

TS-2263

Temperature Rating

-55 (Deg) C to +125 (Deg) C

Termination Method

Press Fit

Termination Style

Printed Circuit Board

Test Voltage

750 VAC (rms)

Withdrawl Force

>= 0.15N/PIN

Withstanding Voltage

750 Vrms

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Similar products

Connector Style Pin Header
Contact Base Material Copper Alloy
Contact Resistance <= 20 MilliOhms
Current Rating 1.0 A
Electrical Load 1.0 Ampere at +70 Degree C
Insulation Color Beige
Insulation Flammability Rating UL 94V-0
Insulation Material Glass Filled Polyester (PBT)
Insulation Resistance >= 10,000 MegaOhm
Mating Contact Finish Material Gold
Mating Contact Finish Thickness (Imperial) 30 µin
Mating Contact Finish Thickness (Metric) 0.76 µm
Mating Force 0.75 N/contact maximum
Mounting Type Boardmount
Number of Contact Rows 5 , 7
Number of Contacts 95 , 154
Orientation Vertical
PCB Mounting Style Through Hole
PCB Thickness 2.4-5.6 mm for 3.7 mm tails, 1.4-5.6 mm for 2.3 mm tails
Packaged Form Bulk
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