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The 3M™ CP2 Press-Fit Header, CP2 Series helps achieve high signal density in cost-effective applications. Modular headers use a basic unit of 25 mm, and can be designed in versatile 38, 44 or 50 modules with 2 mm grid spacing. Type AB, 95, 110 and 125 2 mm signal contacts feature a press-fit pin design that helps verify smooth and accurate connections. Three contact mating levels make these headers excellent for hot swapping and early mate/late break applications.
End-stackable header mates with 5 row 3M™ MetPak™ sockets. The 3M press-fit header, CP2 series is available with additional grounding rows for greater ground bounce and EMI control, as well as feed through termination for midplane applications.
Connector Style | Pin Header |
Contact Base Material | Copper Alloy |
Contact Resistance | <= 20 MilliOhms |
Current Rating | 1.0 A |
Electrical Load | 1.0 Ampere at +70 Degree C |
Insulation Color | Beige |
Insulation Flammability Rating | UL 94V-0 |
Insulation Material | Glass Filled Polyester (PBT) |
Insulation Resistance | >= 10,000 MegaOhm |
Mating Contact Finish Material | Gold |
Mating Contact Finish Thickness (Imperial) | 30 µin |
Mating Contact Finish Thickness (Metric) | 0.76 µm |
Mating Force | 0.75 N/contact maximum |
Mounting Type | Boardmount |
Number of Contact Rows | 5 , 7 |
Number of Contacts | 95 , 154 |
Orientation | Vertical |
PCB Mounting Style | Through Hole |
PCB Thickness | 2.4-5.6 mm for 3.7 mm tails, 1.4-5.6 mm for 2.3 mm tails |
Packaged Form | Bulk |
Pitch (Imperial) | 0.079 in |
Pitch (Metric) | 2 mm |
Press-In Force | <= 204N/pin on nominal hole diameter |
Product Series | CP2 |
Recommended PCB Plated Through Hole | Ø 0.6 ± 0.05 mm |
Retention Force | >= 13.5 N/pin on nominal hole diameter |
Separable | Yes |
Tech Sheet Number | TS-2263 |
Temperature Rating | -55 (Deg) C to +125 (Deg) C |
Termination Method | Press Fit |
Termination Style | Printed Circuit Board |
Test Voltage | 750 VAC (rms) |
Withdrawl Force | >= 0.15N/PIN |
Withstanding Voltage | 750 Vrms |
Data Sheets
(PDF, 914KB)
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