Email Us
Our apologies...
An error has occurred while submitting. Please try again later...
Thank you!
Your form was submitted successfully
The 3M™ High-Speed Card-Edge Connector, SPD08 Series is excellent for high-speed board-to-board connections. Its 0.8 mm pitch, two-row design helps conserve board space and simplify trace routing. The connector supports mezzanine board stacking applications requiring transmission of high-speed (up to 15 Gbps at 30 mm stack height) controlled impedance signals. It also supports wire-to-board applications up to 25 Gbps using 3M™ Twin Axial Cable. Its robust contact design tolerates some misalignment and supports blind mate applications.
With a flexible stacking height from 16 mm to 40 mm using a PCB intermediate riser card, the 3M connector SPD08 series is excellent for high-density applications in datacom, enterprise servers, telecom, industrial, test, military and more.
Card Standard | Dual Edge, PCI Express™ |
Connector Style | Receptacle |
Current Rating | 1.2 A |
Features | Board Guide, Latch, Cantilever |
Mating Contact Finish Material | Gold |
Mating Contact Finish Thickness (Imperial) | 30 µin |
Mating Contact Finish Thickness (Metric) | 0.76 µm |
Maximum Operating Temperature (Celsius) | 125 ℃ |
Maximum Operating Temperature (Fahrenheit) | 257 ℉ |
Minimum Operating Temperature (Celsius) | -55 ℃ |
Minimum Operating Temperature (Fahrenheit) | -67 ℉ |
Mounting Type | Boardmount |
Number of Contact Rows | 2 |
Number of Contacts | 20 , 30 , 40 , 50 , 60 , 80 , 100 , 120 , 140 , 160 , 180 , 200 |
Packaged Form | Tape & Reel, Tray |
Product Color | Black |
Product Series | SPD08 |
Tech Sheet Number | TS-2420 |
Regulatory Data Sheet
Document Number: MSDS_3813995_US_EN_RDS
(PDF)
An error has occurred while submitting. Please try again later...
Your form was submitted successfully