3M™ Chip Carrier Sockets, 4-Row, SM, 8400 Series, TS2147
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3M™ Chip Carrier Sockets, 8400 Series
- 3M ID B00036327
- UPC 00051111663202
Details
Highlights
- Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular
- High temperature insulator compatible with IR reflow and wave soldering
- Compatible with automated loading equipment
- Open top design allows unrestricted air flow
- Molded slots for ease of device extraction
- Available with optional PCB locating posts
- RoHS Compliant. See Regulatory Information Appendix link for chemical compliance information
- For more information, refer to Data Sheet TS2147 (TS-2147)
Surfacemount
Typical properties
| Contact Base Material | Copper Alloy |
| Contact Underplating Material | Nickel |
| Contact Underplating Thickness (Imperial) | 50.0 µin |
| Contact Underplating Thickness (Metric) | 1.27 µm |
| Current Rating | 1.0 A |
| Frame Style | Closed |
| Insulation Material | Glass Filled Polyphenylene Sulfide (PPS) |
| Integrated Circuit Type | PLCC |
| Mating Contact Finish Material | Matte Tin |
| Mating Contact Finish Thickness (Imperial) | 160 µin |
| Mating Contact Finish Thickness (Metric) | 4.06 µm |
| Maximum Operating Temperature (Celsius) | 105 ℃ |
| Maximum Operating Temperature (Fahrenheit) | 221 ℉ |
| Minimum Operating Temperature (Celsius) | -40 ℃ |
| Minimum Operating Temperature (Fahrenheit) | -40 ℉ |
| Number of Contact Rows | 4 |
| Number of Contacts | 20 , 28 , 32 , 44 , 52 , 68 , 84 |
| PCB Mounting Style | Surface Mount |
| Pitch (Imperial) | 0.05 in |
| Pitch (Metric) | 1.27 mm |
| Tech Sheet Number | TS-2147 |
Resources
Data Sheets
(POSTSCRIPT, 757KB)
Data Sheets
(PDF, 139KB)
