3M™ Wafer Support System BrochureContact a Sales Rep
Our apologies...
An error has occurred while submitting. Please try again later...
Thank you!
Your form was submitted successfully
3M™ Wafer De-Taping Tape 3305, 210 mm x 100 m, 4/Case
- 3M ID 7100079058
- UPC 00051141415277
Required products
Details
Highlights
- Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
- Transparency allows for inspection without tape removal
- High instant adhesion to substrate
- Good holding power
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.
Typical properties
| Adhesive Type | Rubber Resin |
| Backing (Carrier) Material | Polyester |
| Brands | 3M™ |
| Product Color | Transparent |
| Total Tape Thickness without Liner (Imperial) | 2.68 mil |
| Total Tape Thickness without Liner (Metric) | 68 Micron |
| Overall Length (Imperial) | 109.361 yd |
| Overall Length (Metric) | 100 m |
| Overall Width (Imperial) | 8.27 in |
| Overall Width (Metric) | 210 mm |
Resources
Brochures
(PDF, 457KB)
Legal disclaimer
The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.
